Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: LFQFP
External dimensions/length: 14 mm
External dimensions/width: 14 mm
External dimensions/packaging: LFQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7024L15PFG
|
Integrated Device Technology | 功能相似 | TQFP-100 |
SRAM, 64 Kbit, 4K x 16位, 4.5V 至 5.5V, TQFP, 100 引脚, 15 ns
|
||
70V24L15PFG
|
Integrated Device Technology | 功能相似 | TQFP-100 |
SRAM, 64 Kbit, 4K x 16位, 3V 至 3.6V, TQFP, 100 引脚, 15 ns
|
||
IDT7024L15PFG
|
Integrated Device Technology | 功能相似 | LQFP-100 |
RAM,IDT ### SRAM(静态随机存取存储器)
|
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