Technical parameters/number of contacts: 32
Technical parameters/Contact electroplating: Gold
Technical parameters/installation angle: 180 °
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 32
Packaging parameters/pin spacing: 2.54 mm
External dimensions/length: 40.6 mm
External dimensions/width: 17.8 mm
External dimensions/height: 3.18 mm
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Beryllium Copper
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1-1571550-0
|
TE Connectivity | 功能相似 |
32 位置 7.62 mm 排间距 2.54 mm 中心线 通孔 Dip 插座
|
|||
3-1571552-0
|
TE Connectivity | 功能相似 | - |
AMP FROM TE CONNECTIVITY 3-1571552-0 插座, DIP, 32路, 通孔安装
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5-1571552-0
|
TE Connectivity | 功能相似 | - |
TE CONNECTIVITY 5-1571552-0 芯片插座, DIP, 触点数:32, 排距:0.6""
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5-1571552-0
|
Tyco Electronics | 功能相似 |
TE CONNECTIVITY 5-1571552-0 芯片插座, DIP, 触点数:32, 排距:0.6""
|
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