Technical parameters/number of rows: 1
Encapsulation parameters/installation method: Through Hole
Physical parameters/color: Black
Physical parameters/contact material: Phosphor Bronze
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
68000-103HLF
|
Future Communications IC | 完全替代 |
68000-103HLF,3P,触点镀金,脚间距2.54mm 袋装
|
|||
68000-203HLF
|
FCI Electronics | 功能相似 |
AMPHENOL FCI 68000-203HLF 板至板连接器, 针座, 3路, 1排
|
|||
68000-203HLF
|
Amphenol | 功能相似 |
AMPHENOL FCI 68000-203HLF 板至板连接器, 针座, 3路, 1排
|
|||
68000-203HLF
|
Amphenol ICC | 功能相似 |
AMPHENOL FCI 68000-203HLF 板至板连接器, 针座, 3路, 1排
|
|||
68000-603
|
FCI Electronics | 完全替代 |
Conn Unshrouded Header HDR 3POS 2.54mm Solder ST Thru-Hole Bag
|
|||
68000-603
|
Amphenol ICC | 完全替代 |
Conn Unshrouded Header HDR 3POS 2.54mm Solder ST Thru-Hole Bag
|
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