Encapsulation parameters/Encapsulation: PGA
External dimensions/packaging: PGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
WSF128K16-72H1CA
|
Microsemi | 功能相似 | PGA |
Memory Circuit, Flash+SRAM, 128KX16, CMOS, CPGA66, 1.075 X 1.075INCH, CERAMIC, HIP-66
|
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