Technical parameters/thermal resistance: 50 ℃/W
Technical parameters/thermal resistance (forced airflow): 2.0℃/W @300LFM
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: TO-218
External dimensions/length: 38.10 mm
External dimensions/width: 16.26 mm
External dimensions/height: 38.1 mm
External dimensions/packaging: TO-218
Physical parameters/color: Black
Physical parameters/materials: Aluminum
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review