Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: CDIP
External dimensions/length: 32.5 mm
External dimensions/width: 7.62 mm
External dimensions/packaging: CDIP
External dimensions/thickness: 3.56 mm
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
6116LA70TDB
|
Integrated Device Technology | 功能相似 | DIP |
Standard SRAM, 2KX8, 70ns, CMOS, CDIP24, 0.3INCH, CERAMIC, DIP-24
|
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