Technical parameters/power supply voltage: 3V ~ 5.5V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/length: 4.9 mm
External dimensions/width: 3.9 mm
External dimensions/height: 1.5 mm
External dimensions/packaging: SOIC-8
External dimensions/thickness: 1.50 mm
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
574MILF
|
Integrated Device Technology | 完全替代 | SOIC-8 |
零延迟缓冲器, 160MHZ, -40 至 85度 C
|
||
ICS570BILF
|
Integrated Device Technology | 完全替代 | SOIC-8 |
IDT) ### 时钟发生器/缓冲器
|
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