Technical parameters/Contact electroplating: Silver
Technical parameters/rated current: 200 mA
Technical parameters/direction: Vertical
Technical parameters/contact type: SPDT
Technical parameters/number of pins: 9
Technical parameters/rated current (Max): 0.2 A
Technical parameters/Contact resistance (Max): 15 mΩ
Encapsulation parameters/installation method: Panel, Solder Lug
Encapsulation parameters/Encapsulation: 200
External dimensions/length: 12.7 mm
External dimensions/height: 9.01 mm
External dimensions/diameter: 12.7 mm
External dimensions/packaging: 200
Physical parameters/contact material: Brass
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
Customs information/HTS code: 8536509020
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