Technical parameters/number of circuits: 1
Encapsulation parameters/Encapsulation: -
External dimensions/packaging: -
Physical parameters/contact material: Beryllium Copper
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BK/5682-11
|
Cooper Bussmann | 功能相似 | Screw |
保险丝夹 TRON FUSECLIP
|
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