Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UC2870DW-1
|
TI | 功能相似 | SOIC |
DC DC Cntrlr Dual-OUT Step Down 4.5V to 36V Input 18Pin SOIC
|
||
|
|
TI | 功能相似 | SOIC |
High Efficiency, Synchronous, Step-down (Buck) Controller 18-SOIC 0 to 0
|
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