Technical parameters/number of contacts: 13
Technical parameters/number of rows: 1
Technical parameters/number of pins: 13
Technical parameters/rated current (Max): 1A/contact
Technical parameters/Contact resistance (Max): 20 mΩ
Encapsulation parameters/installation method: Surface Mount
External dimensions/height: 4.8 mm
Physical parameters/shell color: Natural
Physical parameters/color: Natural
Physical parameters/contact material: Phosphor Bronze
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: Automotive, General Motors, Industrial, Medical
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
53398-1390
|
Molex | 完全替代 |
1.24线对板CONN 。 WAFER ASSY FOR SMT 1.24 WIRE To BOARD CONN. WAFER ASSY FOR SMT
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review