Encapsulation parameters/Encapsulation: -
External dimensions/packaging: -
Physical parameters/contact material: Copper Alloy
Other/Manufacturers: ERNI Electronics
Other/Product Types: Board to Board & Mezzanine Connectors
Other/RoHS: Compliant with RoHS
Other/Products: Connectors
Other/Pitch: 1 mm, 1.5 mm
Other/End Connection Types: SMD/SMT
Other/Installation Angle: Vertical
Other/Series: MicroSpeed
Other/Packaging: Reel
Other/Contact Electroplating: Gold
Other/shell materials: Liquid Crystal Polymer (LCP)
Other/Trademark: ERNI
Other/Contact Materials: Copper Alloy
Other/Stacking Height: 6 mm
Other/Factory Packaging Quantity: 400
Other/Subcategory: Board to Board & Mezzanine Connectors
Other/Trademark Names: MicroSpeed
Compliant with standards/RoHS standards: RoHS Compliant
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