Technical parameters/thermal resistance: 8.9 ℃/W
Technical parameters/thermal resistance (forced airflow): 2.1℃/W @200LFM
Encapsulation parameters/Encapsulation: BGA
External dimensions/length: 50.00 mm
External dimensions/packaging: BGA
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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