Technical parameters/number of contacts: 1
Technical parameters/Contact electroplating: Tin
Encapsulation parameters/installation method: Surface Mount
External dimensions/length: 3.63 mm
External dimensions/inner diameter dimensions: 1.02 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -65℃ ~ 125℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2-5332070-2
|
TE Connectivity | 完全替代 | Surface Mount |
Conn Discrete Socket SKT 1POS Solder ST SMD Loose
|
||
|
|
Tyco Electronics | 完全替代 |
Conn Discrete Socket SKT 1POS Solder ST SMD Loose
|
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