Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Memory configurations: 4M×8
Other/Speed: 0.45
Other/Power supply voltage: 1.8±0.1V
Other/Package: FBGA
Other/Type: Synchronous
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