Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: Die
External dimensions/packaging: Die
Other/Matching Style: SMD/SMT
Other/Package/Case: Die
Other/Memory Size: 16 kbit
Other/Interface Types: Serial, 2-Wire, I2C
Other/Organization: 2 k x 8
Other/Data Retention: 200 Year
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