Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2-1571999-9
|
Tyco Electronics | 类似代替 | DIP |
SWITCH DIP PIANO 8POS SMD 24V
|
||
2-1571999-9
|
TE Connectivity | 类似代替 |
SWITCH DIP PIANO 8POS SMD 24V
|
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