Technical parameters/insulation resistance: 5000 MΩ
Technical parameters/number of rows: 2
Technical parameters/number of pins: 14
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/length: 17.78 mm
External dimensions/width: 10.16 mm
External dimensions/packaging: DIP
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -55℃ ~ 105℃
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
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