Technical parameters/Contact electroplating: Gold
Technical parameters/insulation resistance: 5000 MΩ
Technical parameters/installation angle: 180 °
Technical parameters/operating temperature (Max): 165 ℃
Technical parameters/operating temperature (Min): -65 ℃
Encapsulation parameters/installation method: Panel
External dimensions/length: 38.1 mm
External dimensions/inner diameter dimensions: 16.0 mm
Physical parameters/contact material: Phosphor Bronze
Physical parameters/insulation material: Teflon
Physical parameters/weight: 47.00000 g
Physical parameters/operating temperature: -65℃ ~ 165℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Communications & Networking, RF Communications, Communication and networking, RF communication
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
Customs information/HTS code: 8536694010
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
172124
|
Connex | 类似代替 |
AMPHENOL RF 172124 射频/同轴转接头, 隔板安装, N型 母至母
|
|||
172124
|
Amphenol | 类似代替 |
AMPHENOL RF 172124 射频/同轴转接头, 隔板安装, N型 母至母
|
|||
MC000245
|
Multicomp | 功能相似 |
MULTICOMP MC000245 射频/同轴适配器, 同轴同系列, 直型隔板安装转接器, N, 插座, N, 插座
|
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