Encapsulation parameters/installation method: Through Hole
External dimensions/length: 7.16 mm
Physical parameters/contact material: Copper Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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|
Mill-Max | 功能相似 | Through Hole |
电路板硬件 - PCB 300u ELECTRO-SOLDER
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