Technical parameters/Contact electroplating: Gold, Gold over Nickel
Technical parameters/Contact resistance: 10 mΩ
Encapsulation parameters/installation method: PCB
External dimensions/length: 5.08 mm
External dimensions/width: 1.98 mm
External dimensions/height: 1.98 mm
External dimensions/inner diameter dimensions: 940 µm
Physical parameters/contact material: Beryllium Copper
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
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