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Model NC7SV157L6X
Description TinyLogic ULP-A，Fairchild Semiconductor ### TinyLogic Series, Fairchild Semiconductor's TinyLogic ® The series includes a wide range of high-speed, low-power, CMOS single and dual gate logic functions, with six space saving packages to choose from: SOT23-5, SC70 6-wire, US8 8-wire, and MicroPak 6 and 8-terminal no wire packages. Reducing wiring complexity and shortening metal routes can minimize EMI generation and prevent unnecessary power consumption caused by unused gates. The HS and HST series are designed for 5V or very low-speed applications. The UHS series is particularly suitable for high-speed and low-voltage operations, while the ULP series is particularly suitable for ultra high speed and low-voltage operations. The ULPA series is particularly suitable for low-power and low-voltage operations
Product QR code
Brand: Fairchild
Packaging UFDFN-6
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
1.4  yuan 1.4yuan
5+:
$ 1.8914
25+:
$ 1.7513
50+:
$ 1.6532
100+:
$ 1.6112
500+:
$ 1.5831
2500+:
$ 1.5481
5000+:
$ 1.5341
10000+:
$ 1.5131
Quantity
5+
25+
50+
100+
500+
Price
$1.8914
$1.7513
$1.6532
$1.6112
$1.5831
Price $ 1.8914 $ 1.7513 $ 1.6532 $ 1.6112 $ 1.5831
Start batch production 5+ 25+ 50+ 100+ 500+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(7790) Minimum order quantity(5)
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Technical parameters/power supply voltage (DC): 3.30 V

Technical parameters/number of output interfaces: 1

Technical parameters/contact type: DPST

Technical parameters/number of inputs: 2

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Technical parameters/power supply voltage: 0.9V ~ 3.6V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 6

Encapsulation parameters/Encapsulation: UFDFN-6

External dimensions/length: 1.45 mm

External dimensions/width: 1 mm

External dimensions/height: 0.5 mm

External dimensions/packaging: UFDFN-6

Physical parameters/operating temperature: -40℃ ~ 85℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Customs information/ECCN code: EAR99

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
NC7SP157L6X NC7SP157L6X ON Semiconductor 完全替代 SIP-6
NC7SP157L6X 解码器、多路复用器、信号开关 MAC06A/6-UFDFN/TSOP-6 标记
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