Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GDP02
|
Alcoswitch | 功能相似 | Through Hole |
DIP, Rotary DIP, SIP Switches and DIP Shunts - Standard
|
||
GDP02
|
TE Connectivity | 功能相似 |
DIP, Rotary DIP, SIP Switches and DIP Shunts - Standard
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review