Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: CDIP
External dimensions/packaging: CDIP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
8103609RA
|
TI | 完全替代 | CDIP |
标准高速PAL电路 STANDARD HIGH-SPEED PAL CIRCUITS
|
||
PAL16R6AMJ
|
TI | 完全替代 | CDIP |
标准高速PAL电路 STANDARD HIGH-SPEED PAL CIRCUITS
|
||
TIBPAL16R6-30MJ
|
TI | 完全替代 | CDIP-20 |
低功耗高性能影响é PAL电路 LOW-POWER HIGH-PERFORMANCE IMPACT E PAL CIRCUITS
|
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