Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: SOIC
External dimensions/length: 15.6 mm
External dimensions/width: 7.6 mm
External dimensions/height: 2.45 mm
External dimensions/packaging: SOIC
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC154D,653
|
NXP | 功能相似 | SOIC-24 |
NXP 74HC154D,653 芯片, 解码器/信号分离器, 4:16, SOIC-24
|
||
CD74HC154M
|
TI | 功能相似 | SOIC-24 |
TEXAS INSTRUMENTS CD74HC154M 芯片, 74HC 逻辑器件, SMD
|
||
CD74HC154M96
|
TI | 功能相似 | SOIC-24 |
TEXAS INSTRUMENTS CD74HC154M96 逻辑芯片, 译码器/信号分离器, 单路, 4:16, SOIC-24
|
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