Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: Aluminum
External dimensions/length: 57.25 mm
External dimensions/width: 18 mm
External dimensions/height: 4.2 mm
External dimensions/packaging: Aluminum
Physical parameters/color: Black
Physical parameters/materials: Aluminum
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/ELV standards: Compliant
Customs information/ECCN code: EAR99
Customs information/HTS code: 8542900000
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1542706-3
|
TE Connectivity | 功能相似 | Aluminum |
Heat Sink Passive XFP Pin Array Adhesive Aluminum Electroless Nickel
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review