Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX3747AEUB
|
Maxim Integrated | 类似代替 | TFSOP-10 |
155Mbps至3.2Gbps速率,低功耗SFP限幅放大器 155Mbps to 3.2Gbps, Low-Power SFP Limiting Amplifiers
|
||
SY88933ALKG
|
Microchip | 完全替代 | MSOP-10 |
SP Amp Limiting Post Amplifier Single 3.6V 10Pin MSOP
|
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