Technical parameters/Contact electroplating: Gold
Technical parameters/direction: Straight
Encapsulation parameters/installation method: PCB, Vertical, Solder
External dimensions/diameter: 3.18 mm
External dimensions/inner diameter dimensions: 3.18 mm
Physical parameters/contact material: Beryllium Copper
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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