Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOT-23-6
External dimensions/packaging: TSOT-23-6
Physical parameters/operating temperature: 150℃ (TJ)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NCP1351BDR2G
|
ON Semiconductor | 功能相似 | SOIC-8 |
TOFF可变离线开关电源控制器
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NCP1380DDR2G
|
ON Semiconductor | 功能相似 | SOIC-8 |
准谐振电流模式控制器
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