Technical parameters/RAM size: 2 KB
Technical parameters/digits: 8
Technical parameters/kernel architecture: AVR
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Other/Manufacturing Applications: Communications & Networking, Communication and Network
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
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