Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 6
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX6895AAZT+T
|
Maxim Integrated | 功能相似 | TSOT-23-6 |
MAXIM INTEGRATED PRODUCTS MAX6895AAZT+T 芯片, 微处理器监控器, 5.5V, TSOT-23-6
|
||
|
|
TI | 功能相似 |
MAXIM INTEGRATED PRODUCTS MAX6897AALT+T 芯片, 微处理器监控器, 5.5V, UDFN-6
|
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