Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 5.00 mm
External dimensions/width: 4.40 mm
External dimensions/packaging: TSSOP
External dimensions/thickness: 1.00 mm
Other/Product Lifecycle: Obsolete
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC74LCX138DTG
|
ON Semiconductor | 功能相似 | TSSOP-16 |
MC74LCX138 系列 2.3至3.6 V CMOS 3-8 解码器 / 多路解复用器- TSSOP-16
|
||
SN74LVC138APW
|
TI | 功能相似 | TSSOP-16 |
TEXAS INSTRUMENTS SN74LVC138APW 译码器/数据选择器
|
||
SN74LVC138APWR
|
TI | 功能相似 | TSSOP-16 |
TEXAS INSTRUMENTS SN74LVC138APWR 芯片, 逻辑电路 - 译码器/数据选择器
|
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