Technical parameters/number of pins: 900
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 900
Encapsulation parameters/Encapsulation: FCBGA-900
External dimensions/packaging: FCBGA-900
Physical parameters/operating temperature: 0℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC7Z045-1FFG900C
|
Xilinx | 完全替代 | FCBGA-900 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,667 MHz, FCBGA-900
|
||
XC7Z045-1FFG900C
|
Xilinx | 完全替代 | FCBGA-900 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,667 MHz, FCBGA-900
|
||
XC7Z045-2FFG900E
|
Xilinx | 完全替代 | FCBGA-900 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,800 MHz, FCBGA-900
|
||
XC7Z045-2FFG900E
|
Xilinx | 完全替代 | FCBGA-900 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,800 MHz, FCBGA-900
|
||
XC7Z045-2FFG900I
|
Xilinx | 完全替代 | FCBGA-900 |
XC7Z045-2FFG900I 磨码
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review