Package parameters/number of pins: 272
Encapsulation parameters/Encapsulation: BBGA-272
External dimensions/packaging: BBGA-272
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MT90869AG2
|
Microsemi | 功能相似 | BGA-272 |
Switch Fabric 16K x 16K/8K x 8K 1.8V/3.3V 272Pin BGA Tray
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|
|
Microchip | 功能相似 | BGA-272 |
Switch Fabric 16K x 16K/8K x 8K 1.8V/3.3V 272Pin BGA Tray
|
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|
Zarlink | 功能相似 |
Switch Fabric 16K x 16K/8K x 8K 1.8V/3.3V 272Pin BGA Tray
|
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Microchip | 功能相似 | BGA-272 |
Switch Fabric 12K x 12K/8K x 4K 1.8V/3.3V 272Pin BGA Tray
|
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