Technical parameters/number of pins: 484
Technical parameters/RAM size: 256 KB
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FCBGA-484
External dimensions/packaging: FCBGA-484
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC7Z030-1FBG484I
|
Xilinx | 完全替代 | FCBGA-484 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,667 MHz, FCBGA-484
|
||
XC7Z030-1FBG484I
|
Xilinx | 完全替代 | FCBGA-484 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,667 MHz, FCBGA-484
|
||
XC7Z030-2FBG484E
|
Xilinx | 完全替代 | BBGA-484 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,800 MHz, FCBGA-484
|
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