Technical parameters/RAM size: 42K x 8
Technical parameters/dissipated power (Max): 800 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: PG-LQFP-100-8
External dimensions/packaging: PG-LQFP-100-8
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: Automotive and motorcycle body applications.
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
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