Technical parameters/RAM size: 138K x 8
Technical parameters/dissipated power: 1000 mW
Technical parameters/dissipated power (Max): 1000 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 176
Encapsulation parameters/Encapsulation: LQFP-176
External dimensions/packaging: LQFP-176
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR), Reel
Other/Manufacturing Applications: Basic Transmission Management, Advanced Engine Management, Basic Hybrid Management
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review