Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: 0℃ ~ 95℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC850SRZQ50BU
|
NXP | 功能相似 | BGA-256 |
微处理器 - MPU POWERPC MPU W/CPM
|
||
|
|
Motorola | 功能相似 | BGA |
微处理器 - MPU POWERPC MPU W/CPM
|
||
MPC850SRZQ50BU
|
Freescale | 功能相似 | BGA-256 |
微处理器 - MPU POWERPC MPU W/CPM
|
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