Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Motorola | 完全替代 | 256 |
NXP MPC850DSLVR50BU 芯片, 微处理器, 32位, 50MHZ, BGA-256
|
||
MPC850DSLVR50BU
|
NXP | 完全替代 | BGA-256 |
NXP MPC850DSLVR50BU 芯片, 微处理器, 32位, 50MHZ, BGA-256
|
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