Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC8260AZUPJDB
|
NXP | 类似代替 | TBGA-480 |
NXP MPC8260AZUPJDB Microprocessor, 300MHz, 32Bit, 32KB, 1.9V to 2.2V, TBGA-480
|
||
|
|
Motorola | 类似代替 | 480 |
微处理器, PowerQUICC系列PowerQUICC II系列, 32位, 333 MHz, 1.45V至1.6V, TBGA-480
|
||
MPC8270VVQLDA
|
NXP | 类似代替 | TBGA-480 |
微处理器, PowerQUICC系列PowerQUICC II系列, 32位, 333 MHz, 1.45V至1.6V, TBGA-480
|
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