Technical parameters/RAM size: 16K x 8
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP-16-8
External dimensions/packaging: TSSOP-16-8
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XMC1100T016F0032ABXUMA1
|
Infineon | 完全替代 | TSSOP-16-8 |
ARM微控制器 - MCU XMC1000
|
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