Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 201
Encapsulation parameters/Encapsulation: LFBGA-201
External dimensions/packaging: LFBGA-201
Other/Product Lifecycle: Not Recommended for New Designs
Other/Packaging Methods: Tray
Other/Manufacturing Applications: PCI Express To PCI conversion bridge
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
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