Technical parameters/RAM size: 34K x 8
Technical parameters/Analog to Digital Conversion (ADC): 2
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 800 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: PG-LQFP-64-6
External dimensions/packaging: PG-LQFP-64-6
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XE162FN40F80LRABKXUMA1
|
Infineon | 完全替代 | PG-LQFP-64-6 |
单片机(MCU/MPU/SOC) XE162FN40F80LRABKXUMA1 LQFP-64-EP(10x10)
|
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