Technical parameters/RAM size: 50K x 8
Technical parameters/dissipated power: 1000 mW
Technical parameters/Analog to Digital Conversion (ADC): 2
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 1000 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: LQFP-144
External dimensions/packaging: LQFP-144
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XE167FM72F80LRABKXUMA1
|
Infineon | 完全替代 | PG-LQFP-144-13 |
Infineon XE166 系列 MCU 16 bit C166 XE167FM72F80LRABKXUMA1, 100MHz, 576 kB ROM 闪存
|
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