Technical parameters/power supply voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: LBGA-256
External dimensions/packaging: LBGA-256
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Xilinx | 完全替代 | LBGA-256 |
XCR3256XL 10FT256C 磨码
|
||
XCR3256XL-12FTG256C
|
Xilinx | 完全替代 | LBGA-256 |
XCR3256XL 12FTG256C 磨码
|
||
XCR3256XL-7FT256C
|
Xilinx | 完全替代 | LBGA-256 |
XCR3256XL 7FT256C 磨码
|
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