Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: FBGA-48
External dimensions/packaging: FBGA-48
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XCR3064XL-10CSG48C
|
Xilinx | 类似代替 | FBGA-48 |
XCR3064XL 10CSG48C 磨码
|
||
XCR3064XL-7CSG48I
|
Xilinx | 类似代替 | FBGA-48 |
XCR3064XL 7CSG48I 磨码
|
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