Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 324
Encapsulation parameters/Encapsulation: BBGA-324
External dimensions/packaging: BBGA-324
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XCR3512XL-10FGG324C
|
Xilinx | 类似代替 | BBGA-324 |
CPLD CoolRunner XPLA3 Family 12K Gates 512 Macro Cells 97MHz 0.35um (CMOS) Technology 3.3V 324Pin F-BGA
|
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