Technical parameters/power supply voltage (DC): 3.30 V, 3.60 V (max)
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: TSSOP-20
External dimensions/packaging: TSSOP-20
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC17512LSO20C
|
Xilinx | 完全替代 | SOIC-20 |
PROM Serial 512Kbit 3.3V 20Pin SOIC
|
||
XCF02SVOG20C
|
Xilinx | 完全替代 | TSSOP-20 |
XILINX XCF02SVOG20C 芯片, 存储器, PROM, 闪存平台, 2Mb, 20TSSOP
|
||
XCF04SVOG20C
|
Xilinx | 完全替代 | TSSOP-20 |
XILINX XCF04SVOG20C 芯片
|
||
XCF04SVOG20C
|
Xicor | 完全替代 | TSSOP |
XILINX XCF04SVOG20C 芯片
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review