Technical parameters/power supply voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: FBGA-256
External dimensions/packaging: FBGA-256
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC95288XL-6FGG256C
|
Xilinx | 完全替代 | BGA-256 |
XC95288XL 6FGG256C 磨码
|
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