Technical parameters/power supply voltage: 0.97V ~ 1.03V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 900
Encapsulation parameters/Encapsulation: FCBGA-900
External dimensions/packaging: FCBGA-900
Physical parameters/operating temperature: 0℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC7K410T-1FFG900C
|
Xilinx | 完全替代 | FCBGA-900 |
FPGA, KIntex-7, MMCM, PLL, 400 I/O, 400 MHz, 406720单元, 970 mV至1.03 V, FCBGA-900
|
||
XC7K410T-2FFG900C
|
Xilinx | 完全替代 | FCBGA-900 |
FPGA, Kintex-7, MMCM, PLL, 350 I/O, 710 MHz, 406720单元, 970mV至1.03V, FCBGA-900
|
||
XC7K410T-2FFG900I
|
Xilinx | 完全替代 | FCBGA-900 |
FPGA, Kintex-7, MMCM, PLL, 350 I/O, 710 MHz, 406720单元, 970mV至1.03V, FCBGA-900
|
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